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ET-3528B-111W
Features
High Luminous Intensity - Base on InGaN / GaN technology - Wide Viewing Angle : 120 - Excellent Performance and Visibility - Suitable for all SMT assembly methods - IR reflow process compatible - Environmental friendly; RoHS compliance
Typical Applications
Signal and Symbol Luminaire - Indoor and Outdoor Displays - Backlighting (illuminated advertising, general lighting) - Interior Automotive Lighting
C Edison Opto Corporation. All rights Reserved
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Table Of Contents
Outline Dimension ---------------------------------------------------------------------------- 2 Absolute Maximum Ratings --------------------------------------------------------------- 3 Electro-Optical Characteristics ---------------------------------------------------------- 3 VF Rank-------------------------------------------------------------------------------------------- 4 Luminous Intensity Rank -------------------------------------------------------------------4 Dominant Wavelength Rank ---------------------------------------------------------------4 Characteristic Curves ----------------------------------------------------------------------- 5 Reliability Test Item and Condition ----------------------------------------------------- 6 Recommended Reflow Soldering Profile --------------------------------------------- 7 Taping Reel Packing ------------------------------------------------------------------------- 8 Package ------------------------------------------------------------------------------------------ 9 Precaution for Use ---------------------------------------------------------------------------- 10 Note and Revision History------------------------------------------------------------------ 11
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Outline Dimension
Package Outlines
Polarity mark
Unit : mm Tolerance : 0.2 mm
Circuit Diagram
Recommended Soldering Pad
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Polarity
-
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Absolute Maximum Ratings(Ta=25)
Parameter Forward Current Pulse Forward Current Reverse Voltage Power Dissipation Operating Temperature Storage Temperature Soldering Temperature Symbol IF IFP VR Pd Top Tstg Tsld Value 30 100 5 75 -30 ~ +85 -40 ~ +100 Unit mA mA V mW
Reflow Soldering : 255~260/10~30sec Manualnd Soldering : 350/3sec
- IFP condition : pulse width 0.1msec. and duty 1/10.
Electro-Optical Characteristics(Ta=25)
Parameter Forward Voltage(per die) Reverse Current(per die) Luminous Intensity Dominant Wavelength Viewing Angle Symbol VF IR IV d 21/2 Condition IF=20mA VR=5V IF=20mA IF=20mA IF=20mA Min 2.8 125 Typ 470 120 Max 3.6 10 350 Unit V A mcd nm. deg.
- 21/2 is the off-axis angle where the luminous intensity is half of the axial luminous intensity.
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VF Rank(Ta=25)
Bin VG VH VI IF=20mA Condition Min 2.8 3.1 3.4 Max 3.1 3.4 3.6 V Unit
- Forward voltage measurement allowance is 0.1V.
Luminous Intensity Rank(Ta=25)
Bin B C D E F G IF=20mA 200 250 300 Condition Min 125 150 175 Max 150 175 200 250 300 350 mcd Unit
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Luminous Intensity Measurement Allowance is 10%.
Dominant Wavelength Rank(Ta=25) (
Bin X Y IF=20mA Condition Min 465 470 Max 470 nm 475 Unit
- Dominant Wavelength is measured with an accuracy of 1nm
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Characteristic Curves
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Reliability Test Item and Condition
(1) Test Items and Results
No. Test Type Test Conditions
Peak temp.=255~260*3 times (Pre treatment 60/60%RH,120hrs)
units Test Point Failure before after C=0
1.
IR Reflow
22
2.
Temperature Cycle (TC)
-40 to +100 30min. 15min. 30min. (Pre treatment 60/60%RH,120hrs Reflow peak=255~260 *3 times) -40 to +100 2min. 5s 2min. (Pre treatment 60/60%RH,120hrs Reflow peak=255~260 *3 times) Ta=80, 85%RH, If= 20 mA (Pre treatment 60/60%RH,120hrs Reflow peak=255~260 *3 times) Ta=-40 (Pre treatment 60/60%RH,120hrs Reflow peak=255~260 *3 times) Ta=85, 85%RH (Pre treatment 60/60%RH,120hrs Reflow peak=255~260 *3 times) Ta=25, If= 20 mA (Pre treatment 60/60%RH,120hrs Reflow peak=255~260 *3 times)
22
0 cycle 200 cycle
C=0
3.
Thermal Shock (TSK)
22
0 cycle 100 cycle 0hr 500hrs 1000hrs 0hr 500hrs 1000hrs 0hr 500hrs 1000hrs 0hr 500hrs 1000hrs
C=0
4.
High Temp. & Hum. Life test (HTHL) Low Temperature Storage (LTS) High Temp. & Hum. Storage (HTHS) Ambient Temp. Life
22
C=0
5.
22
C=0
6.
22
C=0
7.
test (ATL)
22
C=0
(2) Criterial for Failure
Items Forward Voltage Luminous Intensity Symbol VF IF=20mA IV Decay35% Condition Criterial for Failure Shift 10%
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Recommended Reflow Soldering Profile
1. Soldering conditions
- Reflow soldering should not be done more than twice. - When soldering, do not put stress on the LEDs during heating. - After soldering, do not warp the circuit board. - Repair should not be done after the LEDs have been soldered. When
repair is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will be damaged by repairing or not.
- The encapsulated material of the LEDs is silicone. Therefore
precautions should be taken to avoid the strong pressure on the encapsulated part.
2. Cleaning - It is recommended to use isopropyl alcohol as a solvent to clean the
LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not.
Taping Reel Packing
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Unit : mm
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Package
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Polarity
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Reel
Label
Seal
Label Moisture absorbent material
Moisture proof bag
Package Label
Item Reel Inner box Outer box
Quantity 2000pcs 5 reels 5 inner boxes
Total 2000pcs 10,000pcs 50,000pcs
Dimensions(mm) Diameter=178 240*235*67mm 353*254*256mm
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Precaution for use
1. Storage 1.1 Before opening the package: - The LEDs should be kept at <40 & <90%RH. The LEDs should be
used within a year. When storing the LEDs, moisture proof package with absorbent material (silica gel) is recommended.
1.2 After unpacking - The LEDs should be kept at 30 & 60%RH. The LEDs should be
soldered within 168 hours (7days) after opening the moisture proof package.
- If unused LEDs remain, they should be stored in moisture proof
packages, such as sealed containers with moisture proof package within absorbent material (silica gel).It is also recommended to return the unused LEDs to the original moisture proof package and to seal the moisture proof package again.
- If the moisture absorbent material (silica gel) vapors or expires the
expiration date, baking treatment should be performed by using the following conditions. baking treatment : 60 for 20 hours.
- The LEDs electrode and leadframe comprise a silver plated copper
alloy. The silver surface may be affected by environments. Please avoid conditions which may cause the LEDs being corroded or discolored. The corrosion or discoloration might lower solderability or affect optical characteristics.
- Please avoid rapid transition in ambient temperature, especially in
high humidity environments where condensation can occur.
2. Static electricity - The products are sensitive to static electricity and highly taken care
when handling them.
- Static electricity or surge voltage will damage the LEDs. It is
recommended to wear an anti-electrostatic wristband or an anti-electrostatic gloves when handling the LEDs.
- All devices, equipments and machinery must be properly grounded.
It is recommended that measures be taken against surge voltage to the equipment that mounts the LEDs.
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Note
All the information published is considered to be reliable. However, EDISON OPTO does not assume any liability arising out of the application or use of any product described herein. EDISON OPTO reserves the right to make changes at any time without notice to any products in order to improve reliability, function or design. EDISON OPTO products are not authorized for use as critical components in life support devices or systems without the express written approval from the managing director of EDISON OPTO.
Revision History
Version 1.0 Subjects (major modified since last revision) New Format Date 2007/07/29
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